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Optimization of X-Ray CT Measurement Accuracy for Metal AM Components
This NASA innovation is a method for quantifying and improving accuracy of X-Ray CT-based metal AM part inspection by comparing X-Ray CT data with a high-fidelity 2D surface imaging technique such as surface profilometry. Using surface profilometry that has a NIST-traceable calibration, the technique guarantees a specific level of high fidelity, allowing surface profilometry data to serve as a ground truth reference with which to judge X-Ray CT accuracy and detectability. To deploy the method, both 3D X-Ray CT data and 2D high-fidelity surface images are acquired on the same metal AM part. 3D X-Ray CT data is then segmented and reoriented to extract a 2D X-Ray CT surface image. Measurements of features (e.g., surface-breaking porosity) are then made in both datasets, followed by a comparison of various metrics. This comparison serves two purposes: (a) quantifying the accuracy of the X-Ray CT inspection performed, and (b) providing an objective function which can be minimized to optimize X-Ray CT inspection. The objective function allows engineers to tune X-Ray CT parameters to minimize the function. These optimized parameters can then be implemented to achieve higher accuracy and defect detection reliability in X-Ray CT imaging. Once an X-Ray CT process is optimized for a specific metal AM component, analysis and certification can be accelerated. This technology helps develop X-Ray CT-based metal AM part inspection processes with high accuracy and reliable detectability. Industries for which metal AM parts are desirable and safety, reliability, and fatigue life is of concern (e.g., aerospace, commercial space, automotive, medical) could benefit from the invention. Companies including X-Ray CT inspection system manufacturers using optical sensors and software, NDE data analysis software providers, and end-users in the industries may be interested in licensing this NASA invention.
Sensors
Credit: NASA
Advanced Thermal Inspection with Pulsed Light Emitting Diodes (PLED) Technology
NASA’s PLED thermal inspection system consists of an array of high- powered LED chips configured to deliver controlled pulses of visible light. The system includes 8 LED chip arrays, mounted on an aluminum heat sink and housed in a hood configuration. The inspection hood is specially designed with filters to prevent internal reflections. The LEDs are powered by regulated power supplies and controlled via a computer interface that synchronizes heat pulses with an infrared camera. An acrylic filter is placed over the LEDs to block residual infrared radiation, ensuring that only visible light reaches the target surface. The system’s infrared camera, operating in the mid-wave infrared (MWIR) range does not detect the visible light and captures the transient thermal response of the material, allowing for precise defect detection. By eliminating the need for high-intensity broadband infrared sources, the PLED system provides a cleaner and more accurate thermal response, particularly for unpainted metals and additively manufactured (AM) components. Performance validation of the PLED system has demonstrated significant advantages over traditional flash thermography. In tests on aluminum samples with material loss and AM Ti-6Al-4V metal specimens, the PLED system successfully detected defects with superior contrast and no heat source reflections. Principal Component Analysis (PCA) applied to PLED inspection data revealed clearer defect indications compared to flash-based methods, which introduced unwanted artifacts due to transient reflections. Additionally, the PLED system enabled quantitative thermal diffusivity measurements, offering a new approach to single-sided material characterization. NASA's PLED thermal inspection technology is available for patent licensing. Potential applications include corrosion detection in aerospace components, quality control of AM metal parts, structural health monitoring of industrial materials, and more.
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